China's First SWLP-Packaged IR Chip Draws Under 0.12W

Release date:2026-03-19 Number of clicks:130

Raytron Microelectronics, a subsidiary of leading Chinese infrared detector maker Raytron Technology, has launched the OHLE6081 uncooled infrared focal plane detector—the company's first SWLP-package device featuring 8μm pixel technology.

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The OHLE6081 delivers impressive specs: 8-14μm response, 8μm pixel pitch, 640×512 resolution, and a wide -40°C to 800°C temperature measurement range. Despite this performance, the device weighs under 1 gram and consumes less than 0.12W, balancing high capability with low power.

The breakthrough lies in its industry-first SWLP (Smart Wafer Level Package) technology—a dual-layer design offering excellent dust and particle resistance. Unlike traditional packaging, it enables integration in standard environments, reducing assembly complexity and supporting SMT compatibility for high-volume production. This lowers the barrier to entry for thermal imaging, allowing more companies to develop core modules independently.

The 8μm pixel technology delivers higher resolution and detail recognition while optimizing SWaP (Size, Weight, and Power). With NETD <50mK, the detector produces clear, detailed images suitable for industrial inspection, security, automotive, and consumer applications.

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ICgoodFind: Raytron's OHLE6081, with 8μm pixel and SWLP breakthroughs, strengthens China's IR detector competitiveness, accelerating compact, low-cost thermal imaging solutions.

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